Experimental CubeSat Development Kit & Hardware Blueprint

300,00 $

Take Your Aerospace Projects to Orbit with a Field-Tested, Wire-Free 1U CubeSat Architecture Unlock the blueprint to a highly reliable, flight-validated nanosatellite platform. This premium 1U CubeSat Design Package delivers a complete, professional-grade hardware architecture structured specifically for high-density sensor telemetry, active attitude control, and advanced payload integration. Engineered with a modern wire-free stacking architecture, this design eliminates fragile wiring harnesses by utilizing high-density mezzanine connectors and flexible printed circuit (FPC) cables. It is the ultimate plug-and-play foundation for universities, aerospace startups, research laboratories, and advanced embedded systems engineers looking to deploy or validate space-ready subsystems. Why Choose This Architecture?…

Description

Take Your Aerospace Projects to Orbit with a Field-Tested, Wire-Free 1U CubeSat Architecture
Unlock the blueprint to a highly reliable, flight-validated nanosatellite platform. This premium 1U CubeSat Design Package delivers a complete, professional-grade hardware architecture structured specifically for high-density sensor telemetry, active attitude control, and advanced payload integration.
Engineered with a modern wire-free stacking architecture, this design eliminates fragile wiring harnesses by utilizing high-density mezzanine connectors and flexible printed circuit (FPC) cables. It is the ultimate plug-and-play foundation for universities, aerospace startups, research laboratories, and advanced embedded systems engineers looking to deploy or validate space-ready subsystems.

Why Choose This Architecture?
  • Zero-Wire Stacking Topology: Features three custom-designed PCBs stacked over structural brass standoffs. Inter-board signals are bridged using parallel 36-pin FPC connectors with a 1-to-1 pin-to-trace mapping, isolating high-frequency switching noise and optimizing internal volume.
  • Ready-to-Scale M.2 Expansion: The main flight computer incorporates a high-density 67-position M.2 Key mezzanine interface. This allows developers to seamlessly snap in secondary experimental payloads, high-capacity data logging cards, or edge-compute hardware accelerators.
  • Proven 16 km Communication Range: This architecture has been experimentally validated under real-world conditions, establishing robust, uncorrupted telemetry downlinks over a tested ground line-of-sight distance of 16 km.

Subsystem-by-Subsystem Specifications
1. Centralized On-Board Computer (OBC) & Navigation Hub
At the heart of the satellite is an ultra-capable command center designed for robust multi-tasking:
  • Processing Power: Powered by an 84 MHz 32-bit ARM Cortex-M3 microcontroller (ATSAM3X8E).
  • Sensor Fusion Array: Integrates a high-performance 9-axis BNO085 IMU with its own Cortex-M0+ sensor fusion coprocessor (delivering drift-free quaternion orientation vectors), alongside a secondary low-power 6-axis Bosch BMI270 IMU.
  • Environmental & Optical Sensing Suite: Fully populated with a Renesas HS3003 temperature/humidity sensor, a Lite-On LTR-390 UV and ambient light sensor, and an Avago APDS-9960 RGB color/proximity/gesture sensor.
  • Scientific Payload & Storage Ready: Integrates a dedicated 7-pin SPI camera payload connector and a microSD card socket for high-capacity local flight data logging.
  • On-Board Display & Indicators: Includes a native dot-matrix SSD1306 OLED screen for real-time ground debugging and a physical piezo buzzer.
2. Smart Electrical Power System (EPS)
An autonomous, self-monitoring energy backbone designed to harvest, protect, and regulate power:
  • Dedicated Control: Powered by an independent, low-power 8-bit AVR core (ATmega328P running at 8 MHz) which handles localized battery diagnostics.
  • Dual-Source Charging: Employs four independent solar panels, each routed to its own STMicroelectronics SPV1040TTR step-up switching regulator with a localized Maximum Power Point Tracking (MPPT) algorithm. It also features a USB Type-C ground-charging port powered by a Consonance CN3302 asynchronous boost battery charger.
  • Battery Chemistry Support: Designed for a 2S (two-series) 18650 Lithium-Ion battery array (nominal system voltage of 7.4V, 3000 mAh capacity).
  • Fine-Grained Telemetry: Features four high-side digital INA219 power monitors tracking real-time logic rail, payload rail, charging path, and discharging path currents with extreme accuracy over I2C.
3. Active 3-Axis Attitude Determination & Control System (ADCS)
Maintain spatial stability and execute precise orbital orientation maneuvers:
  • Custom Actuator Geometry: Features a planar, zero-remanence air-core Z-axis coil integrated parallel to the solar panels (307 turns, AWG30) and dual high-density X/Y-axis transverse iron-core cylindrical solenoids (2,679 turns, AWG32).
  • Uniform Driver Electronics: Powered by three Texas Instruments DRV8835 dual H-bridge motor drivers designed to restrict peak power dissipation to 1.50 W per active channel.
  • Highly Responsive Control: Linear scaling of magnetic dipole moments is handled via dynamic Pulse-Width Modulation (PWM) signals from the flight computer.
4. Double-Redundant Wireless Communications (COMMS)
Keep constant contact with your ground segment:
  • Dual-Band Transceivers: Configured with redundant Ebyte LoRa transceivers (supporting both 400 MHz and 900 MHz bands) utilizing impedance-matched 50 Ω microstrip transmission lines.
  • GPS Tracking: Houses a Quectel L80-M39 GNSS receiver module with an integrated patch antenna and a hardware 1-pulse-per-second (1PPS) LED lock indicator.

What is Included in Your Design Purchase?
With this purchase, customers will receive the full digital design assets to manufacture, assemble, and program their own modular 1U CubeSat:
  1. Multi-Layer PCB Schematics & Layout Files: Production-ready PCB designs (including a high-density 6-layer layout for the On-Board Computer and cost-effective 2-layer layouts for the EPS and ADCS).
  2. Complete Bill of Materials (BOM): Standardized, industry-proven Commercial Off-The-Shelf (COTS) component lists.
  3. Mechanical Frame & Stacking Blueprints: Standardized 1U envelope templates (10x10x10 cm) optimized for brass standoff structural assemblies.
  4. Firmware Guidelines: Low-level register architecture mappings for the dual ATmega328P and ATSAM3X8E microcontrollers to jumpstart flight software development.

 

 

 

 

 

 

 

 

 

 

 

No physical product will be shipped. Your purchase includes access to the digital files only.

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